
PRTR5V0U2F; PRTR5V0U2K
Ultra low capacitance double rail-to-rail ESD protection
Rev. 02 — 19 February 2009
Product data sheet
1. Product pro?le
1.1 General description
Ultra low capacitance double rail-to-rail ElectroStatic Discharge (ESD) protection devices
in leadless ultra small Surface-Mounted Device (SMD) plastic packages.
The devices are designed to protect two Hi-Speed data lines or high-frequency signal
lines from the damage caused by ESD and other transients.
PRTR5V0U2F and PRTR5V0U2K integrate two ultra low capacitance rail-to-rail
ESD protection channels and one additional ESD protection diode each to ensure
signal line protection even if no supply voltage is available.
Table 1.
Product overview
Type number
Package
NXP
JEDEC
Package con?guration
PRTR5V0U2F
PRTR5V0U2K
SOT886
SOT891
MO-252
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leadless ultra small
leadless ultra small
1.2 Features
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ESD protection of two Hi-Speed data lines or high-frequency signal lines
Ultra low input/output to ground capacitance: C (I/O-GND) = 1 pF
ESD protection up to 8 kV
IEC 61000-4-2, level 4 (ESD)
Very low clamping voltage due to an integrated additional ESD protection diode
Very low reverse current
AEC-Q101 quali?ed
Leadless ultra small SMD plastic packages
1.3 Applications
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USB 2.0 interfaces
Digital Video Interface (DVI) / High De?nition Multimedia Interface (HDMI) interfaces
Mobile and cordless phones
Personal Digital Assistants (PDA)
Digital cameras
Wide Area Network (WAN) / Local Area Network (LAN) systems
PCs, notebooks, printers and other PC peripherals